LP70G with Bluetooth Software precision Lapping & Polishing Machine, complete with 2 metered abrasive dispensing unit and 2 abrasive cylinders, eccentric sweep facility on four workstations  (220-240v / 50Hz)_1660288
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LP70G with Bluetooth Software precision Lapping & Polishing Machine, complete with 2 metered abrasive dispensing unit and 2 abrasive cylinders, eccentric sweep facility on four workstations (220-240v / 50Hz)

Overview

LP70 Multi-station Lapping & Polishing System

Key Features

  • Four workstations each with a wafer process capacity of up to 100mm/4″
  • Bluetooth enabled features such as automatic plate flatness control and real time data collection and feedback from digital indicator on jigs for end point thickness control and increased accuracy
  • Metered abrasive feed delivery via peristaltic pumps allowing users to set the flow rate between 1-100ml
  • Driven jig roller arm technology greatly increases accuracy and repeatability
  • Plate speeds of between 5 and 100rpm, facilitating faster lapping and polishing rates

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