The Logitech LP70C Bluetooth Lapping & Polishing Machine (1LB74) is a compact, multi-station lapping and polishing system for production and research environments. The supplied configuration is the chemically resistant version with Bluetooth software, 2 metered abrasive dispensing units, 2 abrasive cylinders, eccentric sweep facility on 4 workstations and suitability for sodium hypochlorite-based polishing fluids.
Key Features
- Brand: Logitech
- Model: LP70C
- Part Number: 1LB74
- Product Type: Precision lapping and polishing machine
- Version: Chemically resistant version
- Software: Bluetooth software
- Workstations: 4 workstations
- Workstation Capacity: Up to 100 mm / 4 inch wafer process capacity per workstation
- Maximum Sample Capacity: Up to 150 mm / 6 inch samples with the use of 2 PP8 jigs
- Abrasive Dispensing Units: 2 metered abrasive dispensing units
- Abrasive Cylinders: 2 abrasive cylinders
- Sweep Facility: Eccentric sweep facility on 4 workstations
- Fluid Compatibility: Suitable for sodium hypochlorite-based polishing fluids
- Jig Control: Individually controlled jig speed for each workstation
- Roller Arms: Driven jig roller arms
- Plate Flatness Control: Automatic plate-flatness control through Bluetooth capability
- Data Feedback: Real-time data collection and feedback from digital indicator on PP series jigs
- Power Supply: 220-240 V / 50 Hz
Note: This output is based on the supplied current description only because no public source was found that verified part number 1LB74 as the exact LP70C chemically resistant Bluetooth configuration.
Benefits
- Supports automated lapping and polishing across 4 workstations for repeatable processing.
- Allows concurrent automated processes for production and research workflows.
- Bluetooth-enabled plate-flatness control helps maintain process consistency during operation.
- Real-time jig feedback supports more accurate end-point thickness control.
- Metered abrasive dispensing supports controlled delivery of polishing media during processing.
- Chemically resistant configuration supports use with sodium hypochlorite-based polishing fluids.
Why Choose the Logitech LP70C Bluetooth Lapping & Polishing Machine (1LB74)?
The Logitech LP70C Bluetooth Lapping & Polishing Machine combines the supplied chemically resistant LP70C configuration with Bluetooth automation, abrasive dispensing and 4 workstation processing for precision lapping and polishing workflows. John Morris Group supplies Logitech lapping and polishing equipment for laboratory, research and production environments across Australia and New Zealand.
