The Logitech EP1 Plain Polishing Pad, 20 in / 508 mm (0CON-377) is a single expanded polyurethane pad manufactured for chemical mechanical polishing of hard materials. Its porous, controlled-cell EP1 structure combines high hardness with 7.5% dynamic compressibility and 93% elastic rebound to support planarity and fine surface finishing.
Key Features
- Plain 20 in / 508 mm pad configuration, supplied as one EP1-P polishing pad
- Controlled-cell EP1 structure, using a foamed elastomer construction developed for hard-material polishing
- High-hardness planarising surface, rated at Shore A 96 and Shore D 46
- Porous expanded polyurethane construction, providing the verified surface structure for this pad series
- 2.5 mm pad thickness, based on the manufacturer’s current technical specification
- Controlled mechanical response, with 7.5% dynamic compressibility and 93% elastic rebound
- Defined material density, rated at 0.70 g/cm³
- Efficient abrasive retention, helping support fine surface quality and flatness during polishing
- Pressure-sensitive adhesive backing, supporting attachment to a suitable polishing base plate
- Optimised for silicon, sapphire and optical materials, particularly where planarity is a key processing requirement
Note: Logitech designates the plain EP1-P configuration for sample surfaces measuring less than 20 cm².
Benefits
- Helps achieve improved planarity when polishing hard semiconductor and optical materials.
- Supports consistent surface finishing through controlled compression and recovery behaviour.
- Promotes efficient use of polishing abrasive by retaining it at the working surface.
- Simplifies pad installation through the pressure-sensitive adhesive backing.
- Provides a clearly identified 508 mm plain-pad format for selecting the correct polishing consumable.
Why Choose the Logitech EP1 Plain Polishing Pad, 20 in / 508 mm (0CON-377)?
The Logitech EP1 Plain Polishing Pad, 20 in / 508 mm (0CON-377) combines a hard, controlled-cell polyurethane structure with defined compression and rebound properties for demanding CMP processes. It is designed to support planarity and fine finishing when processing silicon, sapphire and optical materials. John Morris Group supplies this verified Logitech EP1-P consumable for Australian polishing and materials-preparation applications.
