The Logitech Natural Diamond Powder, 50 µm, 20 g (0CON-282) is a high-removal natural diamond abrasive for precision lapping and polishing. Its >99% carbon composition is suitable for processing geological specimens, optical and electro-optical materials, ceramics, metals, calcified tissues and diamond wafers.
Key Features
- Natural diamond abrasive, supplied in a 50 µm particle size for high-removal processing
- High carbon content, with a verified composition of more than 99% carbon
- High-removal grade, positioned at the highest-removal end of Logitech's natural diamond powder range
- 20 g pack size, providing the specified quantity for laboratory lapping and polishing workflows
- Broad polishing-surface compatibility, suitable for soft metal polishing plates and a variety of polishing cloths
- Recommended Logitech carrier fluids, including EthaneDiol 0CON-133 and higher-purity EthaneDiol-Plus 0CON-134
- Typical mixing ratio of 1 to 2 g/L, adjustable according to the requirements of the polishing process
- Continuous agitation during use, helping maintain the abrasive powder within the carrier fluid
Benefits
- Supports high-removal lapping and polishing where a coarse natural diamond abrasive is required.
- Maintains cutting ability longer than conventional abrasive materials for efficient successive processing operations.
- Produces consistent and repeatable results through a uniformly manufactured diamond powder.
- Accommodates diverse materials, including geological specimens, laser glasses, electro-optical materials, ceramics, metals and diamond wafers.
- Allows the carrier fluid to be selected for the sample, including a higher-purity option for water-soluble materials.
Why Choose the Logitech Natural Diamond Powder, 50 µm, 20 g (0CON-282)?
The Logitech Natural Diamond Powder, 50 µm, 20 g (0CON-282) combines a high-removal natural diamond grade with verified carbon content and established carrier-fluid guidance. John Morris Group supplies this Logitech polishing consumable to Australian laboratories requiring consistent abrasive performance across demanding materials-processing applications.
