The Logitech DEMO LP70G is a fully functional, multi-station lapping and polishing system configured with Bluetooth-enabled software for enhanced monitoring and control. This demo unit includes all key hardware—such as dual metered abrasive dispensing units and abrasive cylinders—delivering the same performance as new systems. Designed for precision processing of wafers up to 100 mm, the LP70G is ideal for labs and R&D environments requiring high-throughput and process repeatability at a reduced capital cost.
Product Features
- Four workstations, each with a wafer process capacity of up to 100 mm (4?)
- Bluetooth-enabled features such as automatic plate flatness control and real-time data collection and feedback from digital indicators on jigs for endpoint thickness control
- Metered abrasive feed delivery via peristaltic pumps allowing users to set flow rates between 1–100 ml
- Driven jig roller arm technology greatly increases accuracy and repeatability
- Plate speeds adjustable between 5 and 100 rpm for optimized lapping and polishing rates
- Eccentric sweep facility integrated on all four workstations for uniform material removal
- Operates on 220–240 V / 50 Hz electrical supply
Benefits
- Cost-effective access to high-precision polishing with full hardware configuration
- Multi-sample throughput increases productivity in R&D and QC environments
- Real-time monitoring enhances process control and repeatability
- Compact lab footprint and efficient power use
- Fully tested and maintained demo unit offering new-level performance at reduced price
Why Choose the Logitech DEMO LP70G?
The Logitech DEMO LP70G offers the same advanced features of the standard LP70G model at a significantly reduced investment. With four active workstations, Bluetooth integration, and all essential components included, it delivers reliable, repeatable performance for wafer processing, sample prep, and research-scale applications. Ideal for labs seeking high capability without full new system costs.
