Bonding jigs allow sample materials to be fixed to a substrate such as microscopic slide for production of thin and ultra-thin sections. It is important that the orientation of the sample-bond-substrate is controlled for achieving optimal sample thickness control and parallelism. “Zero bonding” and “controlled thickness bonding” are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.

The six position BJ6 “zero-bonding” jig  has two sets of three loading pistons on either side of the central line.  Two bonding stations are equipped with the large section facility.  Six PTFE load spreaders are supplied with every jig.  This jig is typically used in single workstation geological sample preparation systems or for the bonding of semiconductor wafers.