The Logitech B270 Glass Substrate, 83 mm, 6 mm, Pre-Lapped (0CON-336) is a glass carrier disc for temporarily supporting semiconductor and optoelectronic wafers during thinning and polishing. It has an 83 mm diameter, 6 mm thickness and pre-lapped surface.
Key Features
- B270 glass construction, providing a purpose-made carrier substrate for wafer preparation workflows
- 83 mm diameter, identifying the exact disc size for equipment and process selection
- 6 mm thickness, providing the specified carrier profile for this variant
- Pre-lapped surface, supplied with the initial lapping stage already completed
- Temporary wafer support, designed to carry wafers during controlled material processing
- Suitable for semiconductor and optoelectronic wafers, supporting both application areas
- Single-substrate pack, supplied as one carrier disc
Benefits
- Supports wafers throughout thinning and polishing operations using a dedicated glass carrier.
- Provides a prepared, pre-lapped surface instead of an unlapped substrate.
- Makes variant selection straightforward through clearly defined diameter, thickness and surface preparation.
- Accommodates semiconductor and optoelectronic wafer-processing workflows.
- Allows individual replacement or procurement with one substrate supplied per pack.
Why Choose the Logitech B270 Glass Substrate, 83 mm, 6 mm, Pre-Lapped (0CON-336)?
The Logitech B270 Glass Substrate, 83 mm, 6 mm, Pre-Lapped (0CON-336) provides a clearly specified carrier format for temporary wafer support during thinning and polishing. John Morris Group supplies this manufacturer-identified consumable for semiconductor and optoelectronic material-processing applications.
