The Logitech B270 Glass Substrate, 160 mm, Pre-Lapped (0CON-335) is a higher-density glass carrier disc for temporarily supporting semiconductor and opto-electronic wafers during thinning and polishing. Its 160 mm diameter, pre-lapped format provides stability for 6 inch diameter applications and is designed not to distort during bonding.
Key Features
- 160 mm carrier diameter, identifying the exact substrate size for this variant
- Pre-lapped finish, supplied in the specified pre-lapped configuration
- Higher-density B270 glass construction, providing stability for larger-diameter applications
- Temporary wafer support, designed to carry wafers during material preparation
- Semiconductor and opto-electronic use, suitable for both stated wafer categories
- Thinning and polishing workflows, intended for support during these preparation operations
- Stable for 6 inch diameter applications, using higher-density glass to maintain its form
- Single-unit pack, supplied with a manufacturer-listed pack size of one
Benefits
- Maintains temporary support for delicate wafers throughout thinning and polishing operations.
- Helps preserve bonding stability by resisting distortion during the bonding process.
- Provides a 160 mm carrier format suited to the manufacturer's stated 6 inch diameter applications.
- Supports both semiconductor and opto-electronic wafer preparation workflows with one carrier type.
Why Choose the Logitech B270 Glass Substrate, 160 mm, Pre-Lapped (0CON-335)?
The Logitech B270 Glass Substrate, 160 mm, Pre-Lapped (0CON-335) combines a pre-lapped carrier surface with higher-density glass for stable temporary wafer support. John Morris Group supplies this Logitech consumable to Australian laboratories undertaking semiconductor and opto-electronic thinning, polishing and bonding workflows.
